A delegation from the Ministry of Science and Technology visited Da Nang and attended the Launching Ceremony of the Advanced Packaging Technology Laboratory Project at Da Nang Software Park No. 2.

On July 28, 2025, a delegation from the Ministry of Science and Technology, led by Mr. Nguyen Manh Hung – Member of the Party Central Committee and Minister of Science and Technology, visited and worked in Da Nang City, and attended the Launching Ceremony of the Advanced Packaging Technology Laboratory (Fab-Lab) Project at the Da Nang Centralized Information Technology Park – Software Park No. 2.

Minister Nguyen Manh Hung emphasized: “The Fab-Lab is not only a place for developing advanced packaging technologies but also a cradle for training high-quality engineers and experts — a key human resource for the nation’s semiconductor industry.”

In response to the Minister’s directive, Mr. Luong Nguyen Minh Triet, Chairman of the Da Nang People’s Committee, affirmed: “VSAP Lab will serve as the nucleus for building an innovation cluster in the semiconductor sector, playing a vital role in Da Nang’s strategy to become a high-tech center, attract quality resources, and develop ‘Make in Vietnam’ products.”

Mr. Nguyen Bao Anh, Executive Director of VSAP Lab, introduced the project’s objectives, orientation, and implementation scale. The Fab-Lab is expected to become a model example of the integration between research, training, and pilot production in the field of chip packaging technology, laying the foundation for developing domestic core technological capabilities.

The project has a total investment of 1,800 billion VND, built on an area of 2,288m², with a total usable floor area of more than 5,700m², and is expected to be operational in the fourth quarter of 2026. The project is divided into two main areas: the Lab Area (focusing on research and development of new packaging technologies such as Fan-out Wafer Level Packaging (FOWLP), 2.5D/3D IC, Silicon Interposer, and Silicon-Bridge) and the Fab Area (conducting pilot production on real wafers, equipped with advanced systems such as lithography, wafer bonding, and internationally standardized measurement and testing equipment).

Chairman of the Da Nang People’s Committee, Mr. Luong Nguyen Minh Triet, expressed his gratitude for the timely attention and support of the leaders of the Ministry of Science and Technology towards the city’s orientations for science and technology development. The city is committed to continuing its partnership with enterprises and training institutions in implementing research, technology transfer, and innovative startup activities, aiming to become a high-tech center of the Central region and the entire country.

Right after the launching ceremony, the Minister of Science and Technology visited the R&D Center for High Technology and Semiconductor Chips of FPT. The delegation also visited semiconductor and artificial intelligence startups operating at Software Park No. 2, which have been supported with working spaces under the city’s policy.

At the same time, the Minister met and interacted with students of the VLSI – Physical Design training course organized by DSAC. He praised the students’ dedication to learning, reaffirmed the key role of human resources in the development of the semiconductor industry, and encouraged young people to actively practice, connect with enterprises, and be ready to integrate into the domestic and international labor markets.

The working program of the Ministry of Science and Technology’s leadership in Da Nang City was a meaningful activity, demonstrating not only the Central Government’s support for implementing strategic goals but also recognizing the city’s efforts in effectively promoting major orientations for the development of science, technology, and the semiconductor industry.

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