End-to-end Semiconductor Packaging Solutions
From advanced package design to prototyping, testing, and turnkey production — VSAP Lab provides comprehensive semiconductor packaging services tailored for innovation and precision.
Advanced Packaging Design
Our experts develop tailored designs for cutting-edge semiconductor packaging, focusing on signal integrity, thermal management, and manufacturability. From 2.5D/3D IC to wafer-level packages, we turn complex design concepts into reliable, scalable solutions.
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Turn-key Advanced Packaging Solutions
VSAP Lab delivers complete end-to-end packaging services — from concept, material sourcing, and tooling, to process integration and mass production. Our turn-key approach ensures seamless project execution, faster time-to-market, and consistent product quality.
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Prototyping Solutions
Accelerate innovation with our rapid prototyping service. VSAP Lab provides high-precision prototyping for advanced semiconductor packages, allowing clients to validate new designs quickly before scaling to production.
Testing and Validation
We perform comprehensive electrical, thermal, and reliability testing to ensure every package meets performance and lifetime requirements. Our validation process guarantees consistent quality and compliance with global semiconductor standards.
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